Investigations on Micro Loop Heat Pipe: Design, Fabrication and Mathematical Modeling using Thin-film Evaporation Theory

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dc.contributor.authorAhmed, Shahnawaz
dc.date.accessioned2022-07-18T08:08:57Z
dc.date.accessioned2023-10-26T09:42:50Z
dc.date.available2022-07-18T08:08:57Z
dc.date.available2023-10-26T09:42:50Z
dc.date.issued2020
dc.descriptionSupervisor: Manmohan Pandey
dc.description.abstractSince its inception, micro loop heat pipe has played a significant role in maintaining a constant thermal environment in applications where space is the primary constraint. Hence, it is a promising solution for passive thermal management in small wearable electronic devices like smartphones, smartwatches, ultra-thin laptop. Its most notable characteristics are gravity-independent operation and low maintenance cost due to the absence of any moving parts. In this study, a new design of micro loop heat pipe is presented. Its dimensions are optimized to maximize the heat transport capacity. It is fabricated on a silicon wafer using a relatively simple microfabrication technique. It is then filled with methanol and performance tested. Next, a new mathematical model is developed to investigate the performance of its evaporator. This model is based on evaporating thin-film in an extended meniscus inside a microchannel. Its novelty is that it combines two ideas: the use of the velocity slip boundary condition at the wall and modelling of both retarded and non-retarded components of disjoining pressure. This leads to better simulation of heat transfer phenomenon in the evaporator.en_US
dc.identifier.otherROLL NO.136103007
dc.identifier.urihttps://gyan.iitg.ac.in/handle/123456789/2079
dc.language.isoenen_US
dc.relation.ispartofseriesTH-2623;
dc.subjectMECHANICAL ENGINEERINGen_US
dc.subjectMECHANICAL ENGINEERING
dc.titleInvestigations on Micro Loop Heat Pipe: Design, Fabrication and Mathematical Modeling using Thin-film Evaporation Theory
dc.typeThesis
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